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Company Profile
Established in 2017, minisilicon is a leading mixed-signal and timing product company, which supports a large portfolio of electronic components for optical communications.
Development History
XG-PON customer verification，
4*100G TIA customers verification，
10G ONU Driver+CDR Tape-out
10G ONU TIA market share up to 40%，
Released MCU msMx0xx series for Optical Tranceivers
XGS-PON mass production
10G ER/ZR CDR+Driver design-win multi customers
25G/100G datacom customer verification
Kick-off 4x100G CDR+Driver and CDR+TIA
10G OLT TRx chips were mass-produced, 100G DC was introduced
10G TIA chips were mass-produced, 10G Super TIA was taped out
200G PAM4 CDR was taped out
A+ round of financing was completed
The company completes the A round of financing and enters a new stage
10G TIA and 56G PAM4 TIA chips were successfully mass-produced
Chengdu company was established
5G fronthaul chipset was successfully taped out
Shanghai minisilicon Technology Co., Ltd. was registered
Zhangjiang Office of Shanghai R&D Center Expands
28G/100G datacenter transceiver with CDR combo chip was successfully taped out
10GEPON/XGSPON burst-limiting amplifier successfully passed the third-party test
The company's first chip 10GEPON/XGSPON burst-limiting amplifier was successfully taped out
Shanghai R&D center established
Hangzhou minisilicon technology company was registered
With a rapid growth of silicon photonics application, LiDar and in-vehicle fiber-optic communications, the future market is promising
Explore the new era of light
Intelligence, inspiration
innovation, integrity
R&D Centers
7th Floor, Building 4, No. 388 Shengrong Road, Pudong District, Shanghai
T8-905, The Starry Center, Binjiang District, Hangzhou
No. 508, Building 5, Tian Fu Xin Gu, No.399, Fucheng Avenue, Wuhou District, Chengdu
minisilicon has a mature high-tech team of overseas returnees, in which includes professionals with more than 20 years experience in optical communication. Technical expertise includes optical communication module chip design, high-speed transceivers, high-performance and low-noise frequency synthesizer, and high-speed SerDes PHY, etc.
Formerly appointed Design Director-Microchip，Design Director-Micrel，Chief Engineer-Oxford Semi
Formerly appointed Chief Designer-Cadence，Chief Analog Designer-LSI，Senior IC Designer-XILINX
Formerly appointed Chief Designer-Microchip，Senior Analog Designer-Micrel Inc，Senior Analog Designer-Phaselink
Formerly appointed Supply Chain Manager-Semtech，Global Supply Chain Manager-eSilicon，Program Manager-Verisilicon
Formerly appointed Digital IC Design Engineer-C*Core Technologies，Digital IC Design Engineer-Silan Microelectronics，Analog IC Design Engineer-Silan Opto
Senior Engineer-Realtek
Qualifications
Participate in essential project
minisilicon is responsible for the core electrical chip development in “Photonic Technology” project 1.8
By 2022, minisilicon has achieved the financing of round A+